Wednesday May 8, 2pm-5:00pm Interactive Workshop on Scientific writing - Miranda, a former Nature editor, will share her insights on science writing for the public versus manuscript writing for the scientific community. The workshop will break down the parts of a manuscript and how to craft them for the intended audiences. As part of the workshop, there will be an interactive session where Miranda will provide feedback on your scientific abstracts. If you wish to participate, please prepare one and refer to the following style guide:(https://nam02.safelinks.protection.outlook.com/?url=https%3A%2F%2Furldefense.com%2Fv3%2F__https%3A%2F%2Fwww.nature.com%2Fdocuments%2Fnature-summary-paragraph.pdf__%3B!!GekbXoL5ynDpFgM!TKf49Gq0kfIhW0IqwsgLPMgytcEkV9odfeuX8_T7plmNa-firTlDd7NelQ5qPaA8krPZ3pJL6IdVr9qpGhQNi80%24&data=05%7C02%7Cviktoriia.rutckaia47%40gc.cuny.edu%7C312c8eb8ffa441da30f108dc6dde76f0%7C6f60f0b35f064e099715989dba8cc7d8%7C0%7C0%7C638506049458590943%7CUnknown%7CTWFpbGZsb3d8eyJWIjoiMC4wLjAwMDAiLCJQIjoiV2luMzIiLCJBTiI6Ik1haWwiLCJXVCI6Mn0%3D%7C0%7C%7C%7C&sdata=JXYCu7rJrmIE%2FPRtqVmEEHEoEmuhWjEUA0%2B%2BF%2FnyHSc%3D&reserved=0). Thursday May 9, 10:00am-12:00pm Seminar on Research Publishing – What happens to a paper after submission? This talk will give a behind-the-scenes window into what editors look for in a paper and how the peer review to publication process works. It will also cover the difference between journals at the Nature Portfolio and how they cater to different audiences. Friday May 10, 10:00am-12:00pm Seminar on Researcher Discoverability – This is an interactive talk on strategies for connecting your online identity to your expertise, and its impact on your career. It will go over the tools editors, conference organizers, and more use to find and select invited speakers and specifically what information they need to find. This talk is tailored for audiences pursuing or recently began a career in academia. It is recommended to bring an internet-enabled device. Co-sponsored by: Advanced Science Research Center - the Graduate Center - City University of New York Speaker(s): Miranda Vinay Agenda: Wednesday May 8, 2pm-5:00pm Thursday May 9, 10:00am-12:00pm Friday May 10, 10:00am-12:00pm 85 St. Nicholas Terrace, New York, New York, United States, NY 10031

This seminar will discuss advanced 3D nanofabrication techniques for high-throughput photonics fabrication, by Dr. Amos Meeks. Speaker(s): Amos Meeks Agenda: 6:00 pm Networking starts 6:15 pm Light meals served 7:00 pm Seminar starts Bldg: Forbes Rd. Cafeteria, MIT Lincoln Laboratory, 3 Forbes Rd, Lexington, Massachusetts, United States, 02421

IEEE NJ Coast Section - Executive Committee Meeting (May) (Virtual) ***CANCELED*** Agenda: 1. Vote / Accept Meeting Minutes (Tima) 2. Treasurer's Report (Mike) 3. Chair's Report(s) (Filomena) 4. Old Business (Each Chapter Chair) - Status of Each Chapter - Status of Committee's and Affinity Groups 5. New Business (Each Chapter Chair) - Each Chapters’ Upcoming Plans - Each Committee and Affinity Group Upcoming Plans - Any New Business not already covered - Move To Close Virtual: https://events.vtools.ieee.org/m/400526

The increasing high requirements of wireless communications and sensors are making research and commercialization of millimeter-wave integrated circuits and antennas experience tremendous growth. The advancement of modern CMOS technology facilitates it to become the prevailing technology to achieve low-cost and highly-integrated millimeter-wave integrated circuits. Meanwhile, the compound semiconductor is still a must for low noise and high power millimeter-wave system. As the operating frequency enters the millimeter-wave regime, the circuit component’s size becomes comparable to the electromagnetic wave wavelength. Therefore, a mixed design methodology using both the lumped and distributed elements in the millimeter-wave integrated circuit design is of great interest, not only compound semiconductor but also CMOS integrated circuits. On one hand, to achieve high-integration and high-performance, the heterogeneous packaging architecture to combined the merits of both CMOS and compound semiconductor millimeter-wave integrated circuits is becoming an attractive technology. On the other hand, considering the efficiency, cost, and integration of advanced wireless systems, discrete antenna is no longer suitable for millimeter-wave wireless systems. Therefore, antenna-in-package (AiP) has become the mainstream for millimeter-wave system, which implements an antenna or antennas on (or in) package of chips leading to a high efficiency and highly-integrated radio. In the talk, innovative design approaches and methodologies on millimeter-wave integrated circuits, subsystems and corresponding antenna-in-package will be introduced. This presentation is open to all and both experienced and novice level engineers are welcome to attend. Speaker(s): Prof. Quan Xue Agenda: 6:45pm - WebEx Waiting Room 7:00-8:00pm - Presentation 8:00-8:15pm - Questions Virtual: https://events.vtools.ieee.org/m/418916