Event is in Dubai. UAE and is being Live Streamed. The Live Stream is FREE. Follow link to Register and Attend. Co-sponsored by: IEEE Futtures Virtual: https://events.vtools.ieee.org/m/439447

Medical images constitute a core portion of the information physicians utilize to render diagnostic and treatment decisions. At a fundamental level, the diagnostic process involves two aspects – visually inspecting the image (perception) and rendering an interpretation (cognition). Key indications of expert interpretation of medical images are consistent, accurate and efficient diagnostic performance, but how do we know when someone has attained the level of training required to be considered an expert? How do we know the best way to present images to the clinician to optimize accuracy and efficiency? Artificial intelligence schemes are being developed to assist with medical image acquisition, interpretation, and treatment decision-making, but to optimize and integrate these tools into everyday clinical routines, we need to consider both the technology and the human part of the human-technology interface equation. The advent of digital imaging and associated tools in many clinical specialties, including radiology, pathology, and dermatology, has dramatically changed the way that clinicians view images, how residents are trained, and thus potentially the way they interpret image information, emphasizing our need to understand how clinicians interact with the information in an image during the interpretation process. With improved understanding using tools such as eye-tracking we can develop ways to further improve decision-making and thus improve patient care. Co-sponsored by: IEEE Engineering in Medicine & Biology Society (EMBS) New York Chapter Speaker(s): , Dr. Elizabeth Krupinski Agenda: 12:00 noon - Introduction and Opening Remarks 12:10 pm - Start Presentation 1:15 pm - Questions & Answers 1:30 pm - Conclusion and Closing Remarks Virtual: https://events.vtools.ieee.org/m/437755

'Antenna Science and Engineering: Given the 75th Anniversary of IEEE AP Society'. Co-sponsored by: ED/CAS, VTS, SIGHT Speaker(s): Dr. Debatosh Guha, Agenda: 'Antenna Science and Engineering: Given the 75th Anniversary of IEEE AP Society'. October 14th, 2024 6:15 PM - 6:30 PM - Networking, refreshments 6:30 PM - 7:30 PM - Presentation by Prof. Debatosh Guha followed by discussion and Q/A Room: ECE - 202, 141 Warren St, New Jersey Institute of Technology, Newark, New Jersey, United States, 07103

Second Annual IEEE Upstate NY Workshop on Secure and Sustainable Communications Networks (SSCN) Hosted by the Rochester IEEE Joint Chapters on Communications and Aerospace, the Second IEEE Upstate NY Workshop on Secure and Sustainable Communications Networks (SSCN) will occur on October 15th, 2024, from 9:00 AM to 5:00 PM in the B. Thomas Golisano Auditorium at the Rochester Institute of Technology. In today's interconnected world, communications networks are critical to all organizations, making network security a pressing issue. The complexity of modern networks and the systems that utilize them present significant challenges for both security and privacy. Additionally, the increasing energy demands of the IT and communications sectors further complicate these challenges. The SSCN workshop aims to unite researchers from the Upstate NY region who are focused on various aspects of secure and sustainable communications and networking. This event will provide a platform to explore and discuss research and development efforts from companies and universities across Upstate NY. Participation Opportunities: - Oral Presentations and Posters: Submissions are invited for oral presentations of extended abstracts (maximum 2 pages) and poster presentations (½ page abstract). - Exhibitions: Companies are encouraged to exhibit their products or services at the workshop, with space allocated on a first-come, first-served basis. Interested parties should contact Dr. Nirmala Shenoy ([email protected]) or Garret Arcoraci ([email protected]) as soon as possible. - Sponsorship: Companies can support the workshop through various sponsorship opportunities: - Underwriting the costs of lunch, beverages, or break snacks. - Providing items for the registration hand-out packet, such as pens, notepads, ID badges, or lanyards. Sponsorship Benefits: - The company’s name and logo will be featured on the workshop web page and in the Final Program. - Sponsors will be recognized as Charter Sponsors. For more details and inquiries, please get in touch with Dr. Nirmala Shenoy via email at [email protected]. Important Dates: - Paper/Extended Abstract Submission Deadline: September 15, 2024 (11:00 PM PDT) - Notification of Acceptance: September 30, 2024 - Workshop Date: October 15, 2024 Organizing Committee: - General Chair: (https://www.linkedin.com/in/nirmala-shenoy-94477299/) - Technical Program Chair: (https://www.linkedin.com/in/daryl-johnson-17576110/) - Publicity Chairs: (https://www.linkedin.com/in/billstackpole/) and (https://www.linkedin.com/in/garret-arcoraci-3a4b804/) Submission Links: - Papers: (https://forms.gle/JhwnqfUweF8bkNSy6) - Posters: (https://forms.gle/Yu2wYvwoQyLZo54k6) For paper and poster submissions, please use the IEEE template available (https://www.ieee.org/conferences/publishing/templates.html). Room: 70-2400, Bldg: Golisano College of Computing and Information Sciences, 20 Lomb Memorial Drive, Rochester, New York, United States, 14623

Cyber Security is an Application of Decision Sciences or Why Every Cyber Security Dept Needs a Decision Scientist Cyber has become a big topic. Cyber security may be the new battlefront. The news is covered with stories of this or that company or agency being hacked and the information being for sale on the dark web. It affects business, military, medical, and many forms of life. This presentation gives an overview of what is cyber security and how it is managed. The theory behind the programming is explained covering the concepts of why and how. This is done from the perspective of a decision scientist and programming is not discussed. Many examples are given to demonstrate the concepts. Speaker(s): Dr Brad Morantz, Virtual: https://events.vtools.ieee.org/m/438059

IEEE Reliability Society- Joint Boston/New Hampshire/Providence Chapter Adcom meeting. Speaker(s): , , , Agenda: - Call to Order - Opening Remarks - Officer Reports - Secretary - AdCom Meeting Minutes - Treasurer - Awards - Financials - Vice Chair - Technical Meeting Schedule - Potential Technical Meeting Presentations - Newsletter - Chair Report - Recent Technical Meeting Attendance - Upcoming Technical Meeting Registration - - - 10-SEP-2024 Joint Meeting with SMTA & iMAPS at Nano Dimension in Waltham - 09-OCT-2024 Joint Meeting with ESDA: Tom Meuse— ESD Device Level Testing Die to Die in Direct Pin Injection Testing at the MIT LL Main Cafeteria - 13-NOV-2024 ESD Costly Controversial Myths by Ted Dangelmayer (to be confirmed) - 11-DEC-2024 Ethan Cascio (rescheduled from 26-JUN-2024) - Old Business - MIT Lincoln Laboratory Appreciation / Thank You Plaque and Presentation - Proposed creation of IEEE Boston Reliability Chapter brochure Targeting the Younger Demographic - Facebook, Instagram, Twitter - Website Status - Webmaster moving to Colorado - New Business - Updated information on MGA new voting requirements - June 30th membership is flexible this year because of the new process. - Chapters and Affinity groups can use (must use) the VTools elections platform, but none of the rest of the MGA elections platform (nominations, &c., work for groups below sections until 2025. - Proposed slate of officers - For August September (Annually) - Past Chairs Meeting invitations / RSVPs Officer Election – Open October 30 / Close December 4 - Schedule Next AdCom Meeting - TBD. - Closing Remarks - Adjournment Virtual: https://events.vtools.ieee.org/m/434343

Compact Models (CMs) for circuit simulation have been at the heart of CAD tools for bridging circuit design and technology development over the past decades. In this talk, we begin with an overview of the historical role of CMs and fundamental equations. Evolution of MOSFET CMs, from bulk to SOI and FinFETs, is reviewed and their inter-relationships discussed. Unification of CMs with the unified regional modeling (URM) approach is presented, together with model validation with numerical data and verification with experimental data. Model extension to III-V HEMTs including 2-dimensional electron gas (2DEG) in multiple sub-bands and trap-charge effects is presented. Co-sponsored by: IEEE North Jersey Section Speaker(s): Dr. Xing Zhou Agenda: Event Time: 4:45 PM to 6:30 PM 4:45 PM Refreshments and Networking 5:00 PM Talk by Dr. Xing Zhou EDS DL, Singapore Seminar is in ECEC 202. All Welcome: There is no fee/charge for attending IEEE technical seminar. You don't have to be an IEEE Member to attend. Refreshments are free for all attendees. Please invite your friends and colleagues to take advantage of this Invited Distinguished Lecture. Room: ECE 202, Bldg: ECEC Building, 154 Summit Street, Newark, NJ 07102, NJIT, Newark, New Jersey, United States, 07102

The Ithaca Executive Committee invites you to attend our next meeting. Co-sponsored by: IEEE Cornell Student Section Ithaca, New York, United States

The number of connected devices is expected to reach 500 billion by 2030, which is 59-times larger than the expected world population. Objects will become the dominant users of next-generation communications and sensing at untethered, wireline-like broadband performance, bandwidths, and throughputs. This sub-terahertz 6G communication and sensing will integrate security and intelligence. It will enable a 10x to 100x increase in peak data rates. FPGAs are well positioned to enable intelligent radios for 6G when coupled with high-performance chiplets incorporating RF circuits, data converters, and digital baseband circuits incorporating machine learning and security. This talk presents use of 2.5D and 3D heterogeneous integration of FPGAs with chiplets, leveraging Intel’s EMIB/Foveros technologies with focus on one emerging application driver: FPGA-based 6G sub-THz intelligent wireless systems. Nano-, micro-, and macro-3D heterogeneous integration is summarized, and previous research in 2.5D chiplet integration with FPGAs is leveraged to forge a path towards new 3D-FPGA based 6G platforms. Challenges in antenna, packaging, power delivery, system architecture design, thermals, and integrated design methodologies/tools are briefly outlined. Opportunities to standardize die-to-die interfaces for modular integration of internal and external circuit IPs are also discussed. Speaker(s): Dr Farhana Sheikh, Agenda: 8pm - 9pm EST : DL and Q/A Virtual: https://events.vtools.ieee.org/m/420965

In this webinar, we will discuss the latest developments at NY CREATES in the scalable fabrication of quantum devices. We will highlight our work with superconducting materials such as Ta, Nb, Al, and their oxides and nitrides, detailing the painstaking work required to reformulate CMOS processes to those designed for quantum technologies, which have a wide range of application including in communications, quantum computing, sensing, data security, solid state electronics, nanotechnology, photonics, quantum circuits, advanced fabrication, superconducting digital logic, and superconducting optoelectronics neuromorphic computing. With specific examples, we will illustrate how we leverage decades of learning from the CMOS industry, aiming to enable the fabrication of devices with tightly controlled performance characteristics. We will present the synergistic nature of our process development strategy, that advances a variety of quantum technologies at 300 mm wafer scale. These efforts are essential to establish a well-defined superconducting quantum process design kit (SQPDK) and facilitate the fabrication of quantum circuits that are faithful to designer intent, in a true ‘quantum foundry’ model. NY CREATES (New York Center for Research, Economic Advancement, Technology, Engineering, and Science) is a research and development entity in New York State that focuses on advancing innovation in semiconductor technology and other high-tech industries. It plays a significant role in fostering partnerships between academia, industry, and government to support technological advancements, economic growth, and workforce development. NY CREATES manages and operates several advanced research facilities, including the Albany NanoTech Complex, which is one of the most advanced semiconductor research facilities in the world. The organization works on a variety of projects related to microelectronics, nanotechnology, photonics, and other cutting-edge technologies, aiming to position New York as a global leader in these fields. Contact George Blasiak ([email protected]), Industry Liaison at Syracuse IEEE for more information on the event. Speaker(s): Ekta Bhatia, Ph.D Virtual: https://events.vtools.ieee.org/m/429789

ABOUT THE LECTURE “CHIPS: Execute for Success” Semiconductor innovation is a foundation to national security, economic security and job security in America. Since before the passage of CHIPS and Science Act in summer 2022, federal and state governments, companies and universities have stepped up the effort to revitalize the entire semiconductor supply chain in the U.S. We will review Purdue University’s initiatives in this area and draw some lessons on universities’ role in talent development, research moonshots, and public private partnership. ABOUT THE SPEAKER Professor Mung Chiang, President of Purdue University Mung Chiang is the 13th president of Purdue University and the Roscoe H. George Distinguished Professor of Electrical and Computer Engineering. He was previously the John A. Edwardson Dean of the College of Engineering and executive vice president for strategic initiatives at Purdue University, as well as the Arthur LeGrand Doty Professor of Electrical Engineering at Princeton University. Chiang founded the Princeton EDGE Lab in 2009 and then founded several startup companies and industry consortia in edge computing. As the Science and Technology Adviser to the U.S. Secretary of State in 2020, he initiated tech diplomacy programs for the U.S. government. Currently he serves on the inaugural board of the U.S. Foundation for Energy Security and Innovation and several corporate and nonprofit boards. Chiang received his BS (1999), MS (2000) and PhD (2003) from Stanford University and an honorary doctorate (2024) from Dartmouth College. For his research in communication networks, he received the NSF Alan T. Waterman Award (2013), as well as the IEEE Kiyo Tomiyasu Award (2012), the IEEE INFOCOM Achievement Award (2022) and a Guggenheim Fellowship (2014). He was elected to the American Academy of Arts and Sciences (Class of Mathematical and Physical Sciences 2024), the National Academy of Inventors (2020) and the Royal Swedish Academy of Engineering Sciences (2020). Co-sponsored by: Columbia University Department of Electrical Engineering Room: 400, 530 W120th Street, New York, New York, United States, 10027

Dear IEEE Connecticut Section Member, The IEEE Connecticut Section's Annual General Meeting features networking time, an engaging presentation on a relevant topic followed by an excellent dinner. This is a great opportunity to connect with other IEEE members in Connecticut and catch up with our activities. Member/ Senior Member $30+tax Life Member/ Fellow $15+tax Student Member $15+tax Nonmember $75+tax When registering partners please select your own member grade for them to get the correct cost and not the non-member cost. Dinner options: - Chicken Marsala - Grilled Salmon - Prime Rib - Vegetarian (Vegetable Ravioli with Cheese) - Gluten-Free - upon request Venue: Casa Mia at the Hawthorne 2421 Berlin Turnpike, Berlin, CT 06037 Hope to see you there, Speaker(s): Armen Pischdotchian, Agenda: 6:00pm - Social Hour, Hors d’oeuvres, cash bar 6:30pm - Dinner 7:00pm - Announcements 7:30pm – Speaker + Dessert 9:00pm - Conclusion Bldg: Casa Mia at the Hawthorne, 2421 Berlin Tpke, Berlin, Connecticut, United States, 06037

It’s time again to kick off our season of meetings with the annual computer graphics film show, featuring the latest and greatest computer animations direct from the ACM SIGGRAPH conference held this summer. (We have been running a graphics talk each year since 1980! This year is our 45th!) It will be an entertaining overview of recent advances in computer graphics. Room: 105, Bldg: Computer Science Building, 35 Olden St, Princeton, New Jersey, United States, 08544, Virtual: https://events.vtools.ieee.org/m/437505

Hands-on intro to Fusion Workshop will cover the following: Overview of what fusion is User Interface and Workspaces Part Modeling Assembling Parts Output options (.stp, stl or 2D drawings in .dwg or .pdf) More information will be sent to you once you signed up: Prepping of your computer with the Fusion 360 software in advance. Ensure fusion is installed and working prior to this workshop. (https://r20.rs6.net/tn.jsp?f=001DBnfxMAx-xFzMeJf_3Iifx35eeo9fj8RU7Sq2Iy6mYohHgXJhbwXWrmhHI7hmdJyPuskbk7ZZB51ma6I8iBWDiZSqC4qno1HMyZAW5BBfe1kAzE4WUPZqccC46gdVcTupSdVfS7QfVzhWSKdOeyDTmX-6h3a4dSXodC8BpvbWxKO9MGgDnXFg2mDVxcE-E-w&c=ouVa9BLj_QJcQaHALAs-nRZt_8R120VB7GsdiNv5Yhv0VphgRWBNjw==&ch=pIB_WQQIPEDw7rXS0vhFR4SNb-_s1aNb6EzKi9atERrljd06301iuA==) Click on the Download Fusion 360 Button then watch the video to understand the process you need to take. Sign Up now: Room: 128 A/B, Bldg: School of Engineering, Technology and Aeronatics, 2500 North River Rd., Manchester, New Hampshire, United States, 03106