Ongoing

Deep Learning With Applications

Room: Room 306, Bldg: Becton Building , FDU Metropolitan Campus, 960 River Road, Teaneck, New Jersey, United States, 07666 River Road, Teaneck

September 21 through November 2, 2024. Six Saturdays 1:30-4:30pm (9/21, 9/28, 10/5, 10/19, 10/26, 11/2). The IEEE North Jersey Section Communications Society Chapter is offering a course entitled "DEEP LEARNING WITH APPLICATIONS". Deep learning is a transformative field within artificial intelligence and machine learning that has revolutionized our ability to solve complex problems in various domains, including computer vision, natural language processing, and reinforcement learning. This hands-on course on deep learning is designed to provide students with an understanding how these amazing successes are made possible by drawing inspiration from the way that brains, both human and otherwise, operate. Students will gain a comprehensive foundation in the principles, techniques, and applications of deep neural networks. Learning how to solve real data-set based applications will teach students how to really apply deep learning with Python programming software. Participants will be asked to design and train deep neural networks to perform tasks such as image classification using commonly available data sets. However, participants are encouraged to apply the techniques from this course to other data sets according to their interests. Discuss with the instructor in order to propose your own project. More importantly, this will set the foundations for understanding and developing Generative AI applications. The IEEE North Jersey Section's Communications Society Chapter can arrange for providing IEEE CEUs - Continuing Education Units (for a $5 charge) upon completion of the course. Course prices: $75 for Undergrad/Grad/Life/ComSoc members, $100 for IEEE members, $150 for non-IEEE members Co-sponsored by: Education Committee Speaker(s): Thomas Long, Agenda: 1. Introduction to Neural Networks: Explore the fundamental concepts of artificial neural networks, backpropagation, activation functions, and gradient descent, laying the groundwork for deep learning understanding. 2. Introduction to PyTorch: Learn how to implement and train neural networks using PyTorch one of the most popular deep learning frameworks. Understand tensors. 3. Computer Vision Applications: Apply deep learning to computer vision problems, including image classification and object detection using Convolutional Neural Networks (CNNs) 4. Training and Optimizing Deep Neural Networks: Study techniques for training deep neural networks effectively, including optimization algorithms, weight initialization, regularization, and dropout. 5. Sequential Data Analysis: Explore how deep learning is used to analyze sequential data using Recurrent Neural Networks (RNNs). In particular, explore how neural networks are used in Natural Language Processing (NLP) tasks such as sentiment analysis and machine translation. 6. Generative AI: Overview of generative ai techniques that leverage the patterns present in a dataset to generate new content. Applications of generative ai include large language models such as ChatGPT and image generation models such as Midjourney and Stable Diffusion. This course assumes a basic understanding of machine learning concepts and programming skills in Python. Familiarity with linear algebra and calculus will be beneficial, but not mandatory. Statistical software (Python, Scikit-learn) and Deep Learning Frameworks (Pytorch, TensorFlow) will be used throughout the course for the exploration of different learning algorithms and for the creation of appropriate graphics for analysis. Learning objectives: Subjects covered include these and other deep learning related materials: artificial neural networks, training deep neural networks, RNN, CNN, image recognition, natural language processing, GANs, data processing techniques, and NN architectures. The course is intended to be subdivided into 3-hour sessions. Each lecture is further subdivided into lecture, guided and independent project based exercises to build experience with hands-on techniques. This course will be held at FDU - Teaneck, NJ campus. Checks should NOT be mailed to this address. Can bring checks in person or use online payments at registration. Email the organizer for any questions about course, registration, or other issues. Technical Requirements: Students will need access to the Python programming language. In addition to a standard Python installation, most programming exercises will use the package Scikit-learn. Basic programming skills and some familiarity with the Python language are assummed. Students are expected to be able to bring a laptop onto which most of these libraries can be pre-installed using python's pip install. Most of the coding in this course will use the Python programming language. Coding examples and labs will be distributed in the form of Juypter notebooks. In addition to standard Python, most programming exercises will use either the PyTorch or TensorFlow libraries. Books and other resources will be referenced. Room: Room 306, Bldg: Becton Building , FDU Metropolitan Campus, 960 River Road, Teaneck, New Jersey, United States, 07666

IEEE Futures Networks World Forum 2024

Virtual: https://events.vtools.ieee.org/m/439443 Singapore

Event is in Dubai. UAE and is being Live Streamed. The Live Stream is FREE. Follow link to Register and Attend. Co-sponsored by: IEEE Futtures Virtual: https://events.vtools.ieee.org/m/439443

EDS Distinguished Lecture: Compacting Models: The Art of Compact Modeling (Unification of Compact Models with the Unified Regional Modeling Approach)

Room: ECE 202, Bldg: ECEC Building, 154 Summit Street, Newark, NJ 07102, NJIT, Newark, New Jersey, United States, 07102 Summit Street, Newark

Compact Models (CMs) for circuit simulation have been at the heart of CAD tools for bridging circuit design and technology development over the past decades. In this talk, we begin with an overview of the historical role of CMs and fundamental equations. Evolution of MOSFET CMs, from bulk to SOI and FinFETs, is reviewed and their inter-relationships discussed. Unification of CMs with the unified regional modeling (URM) approach is presented, together with model validation with numerical data and verification with experimental data. Model extension to III-V HEMTs including 2-dimensional electron gas (2DEG) in multiple sub-bands and trap-charge effects is presented. Co-sponsored by: IEEE North Jersey Section Speaker(s): Dr. Xing Zhou Agenda: Event Time: 4:45 PM to 6:30 PM 4:45 PM Refreshments and Networking 5:00 PM Talk by Dr. Xing Zhou EDS DL, Singapore Seminar is in ECEC 202. All Welcome: There is no fee/charge for attending IEEE technical seminar. You don't have to be an IEEE Member to attend. Refreshments are free for all attendees. Please invite your friends and colleagues to take advantage of this Invited Distinguished Lecture. Room: ECE 202, Bldg: ECEC Building, 154 Summit Street, Newark, NJ 07102, NJIT, Newark, New Jersey, United States, 07102

Ithaca Section October Meeting at TBD

Ithaca New York

The Ithaca Executive Committee invites you to attend our next meeting. Co-sponsored by: IEEE Cornell Student Section Ithaca, New York, United States

IEEE PCJS SSCS DL by Dr Farhana Sheikh : FPGA-Chiplet Architectures and Circuits for 2.5D/3D 6G Intelligent Radios

Virtual: https://events.vtools.ieee.org/m/420965

The number of connected devices is expected to reach 500 billion by 2030, which is 59-times larger than the expected world population. Objects will become the dominant users of next-generation communications and sensing at untethered, wireline-like broadband performance, bandwidths, and throughputs. This sub-terahertz 6G communication and sensing will integrate security and intelligence. It will enable a 10x to 100x increase in peak data rates. FPGAs are well positioned to enable intelligent radios for 6G when coupled with high-performance chiplets incorporating RF circuits, data converters, and digital baseband circuits incorporating machine learning and security. This talk presents use of 2.5D and 3D heterogeneous integration of FPGAs with chiplets, leveraging Intel’s EMIB/Foveros technologies with focus on one emerging application driver: FPGA-based 6G sub-THz intelligent wireless systems. Nano-, micro-, and macro-3D heterogeneous integration is summarized, and previous research in 2.5D chiplet integration with FPGAs is leveraged to forge a path towards new 3D-FPGA based 6G platforms. Challenges in antenna, packaging, power delivery, system architecture design, thermals, and integrated design methodologies/tools are briefly outlined. Opportunities to standardize die-to-die interfaces for modular integration of internal and external circuit IPs are also discussed. Speaker(s): Dr Farhana Sheikh, Agenda: 8pm - 9pm EST : DL and Q/A Virtual: https://events.vtools.ieee.org/m/420965