Region 1

Binghamton University, GE Global Research and IBM Research are proud to host the 34th Annual Electronics Packaging Symposium — Small Systems Integration. The program will include two days of exciting invited presentations with a focus on supply chain interconnectivity. We invite you to join us for this event on Sept. 4-5, 2024, at the Binghamton University ITC Complex. We look forward to seeing you in person. The symposium brings together leaders in academia, industry and government to network and discuss the latest advances in the field of electronics packaging, and to bring value from the varying viewpoints of each respective sector. The program will also include keynote presentations and student poster sessions. The goal of the symposium is to have those who attend walk away with insight, career-building opportunities, and the knowledge of having been an integral member in the advancement of the electronics packaging field. Session topics will include: future of computing for HPC/AI, flexible, additive and wearable electronics, heterogeneous integration, photonics packaging, thermal challenges, advanced substrates and power electronics. Also planned are two special panels, the first is a panel to address workforce development challenges to support the CHIPS and Science Act and the second panel to review the new NIST sponsored Heterogeneous Integration Roadmaps, what each of the 4 roadmaps are, where they are focused and how they will help NIST and the electronics packaging industry identify gaps to supporting future packages. Symposium agenda can be found at https://(http://www.binghamton.edu/ieec/eps/agenda.html)(http://www.binghamton.edu/ieec/eps/agenda.html)(http://www.binghamton.edu/ieec/eps/agenda.html)(http://www.binghamton.edu/ieec/eps/agenda.html)(http://www.binghamton.edu/ieec/eps/agenda.html)(http://www.binghamton.edu/ieec/eps/agenda.html)(http://www.binghamton.edu/ieec/eps/agenda.html)(http://www.binghamton.edu/ieec/eps/agenda.html)(http://www.binghamton.edu/ieec/eps/agenda.html)(http://www.binghamton.edu/ieec/eps/agenda.html)(http://www.binghamton.edu/ieec/eps/agenda.html) Register at (https://www.eventbrite.com/e/35th-annual-electronics-packaging-symposium-small-systems-integration-tickets-881352728737?aff=oddtdtcreator) General conference Information including speaker info and exhibitor opportunities: https://www.binghamton.edu/ieec/eps/index.htm Information on Travel and hotels may be found here: https://www.binghamton.edu/ieec/eps/travel.html We hope that you will join us in September. Agenda: https://www.binghamton.edu/ieec/eps/agenda.html Room: Symposium Hall, Bldg: Center of Excellence, Binghamton University State University of New York, 85 Murray Hill Road, Vestal, New York, United States, 13850

[] With preregistration and a nominal fee, CEU units are available for those who attend both tutorials including: - IEEE Future Networks: Security Considerations for Mobile Edge Computing - IEEE Future Networks: 5G NTN Takes Flight: 5G Non-Terrestrial Networks Evolving Towards 6G ABSTRACT 1. Security Considerations for Mobile Edge Computing Mobile Edge Computing (MEC) is a technology framework that brings computational resources, including processing power, storage, and network connectivity, closer to mobile devices and users. In MEC, these resources are deployed at the edge of the cellular network, typically in close proximity to cell towers and base stations. This contrasts with traditional cloud computing, where data processing and s torage occur in centralized data centers that can be distant from the end-user. Key aspects and features of MEC include Low Latency, Proximity, Resource Optimization, Scalability, Context Awareness and Security. Security measures are implemented at the edge to protect sensitive data and ensure the integrity of the network. This can include encryption, access control, and authentication mechanisms. Applications and use cases of MEC are diverse and include AR/VR, IoT, Content Delivery, Connected Vehicles, Smart Grids. MEC is also a critical component in the evolution of 5G networks. The tutorial provides a forum for researchers and engineers from academia and industry to develop a deep understanding of MEC Security. The participants would be exposed to wide and diverse topics in MEC Security, including existing and new attack surfaces and attack vectors along with their mitigation. ABSTRACT 2. 5G NTN Takes Flight: 5G Non-Terrestrial Networks Evolving Towards 6G From the beginning, 3GPPs vision of ubiquitous communication included the usage of satellite or airborne based network components. Heading towards 6G we envision the contribution of NTN into the 6G system, IMT-2030 sets some clear requirements incorporating a non-terrestrial, unified network architecture from it’s inception. Release 17 considered as the start of NTN in 5G targets at enabling non-terrestrial network services. Later releases will enhance the NTN contribution and even if 6G may be an evolution and not a revolution, NTN will play a pivotal role from the advent of 6G. This presentation will outline the technology evolution from the first NTN up to the anticipated technology evolutions on the path to 6G. The NTN technology starts with transparent mode architecture, incorporates regenerative mode and multi-connectivity mobility scenarios on a mid-term basis, and then looks towards long-term aspects like 3D unified and resilient networks, ultimately paving the way towards “beyond cellular” in a 6G network that includes NTN from its inception. In addition we would like to present the evolution of Test and Measurement aspects and how T&M can ensure the successful operation and development of future NTN networks. Tutorials originally presented at the 2023 IEEE Future Network World Forum held November 13-15, 2023 in Baltimore, Maryland USA. Co-sponsored by: IEEE Future Networks Speaker(s): Dr. Amruthur Narasimhan Ph.D., CISSP, Dr. Rajeev Shorey, Dr. Giridhar Mandyam, Reiner Stuhlfauth Agenda: 9:00AM - 9:10AM Introduction by Amruthur Narasimhan 9:10AM - 10:40 AM Security Considerations for Mobile Edge Computing Presented By: Dr. Rajeev Shorey Computer Science & Engineering Department, IIT Delhi & IIT Gandhinagar, India Dr. Giridhar D. Mandyam MediaTek, USA 10:40AM- 10.50AM Questions & Answers 10:50AM - 12:20PM 5G NTN Takes Flight: 5G Non-Terrestrial Networks Evolving Towards 6G Presented By: Reiner Stuhlfauth Technology Manager Wireless Test & Measurement Division of Rohde & Schwarz 12:20PM - 12:30PM Questions & Answers Virtual: https://events.vtools.ieee.org/m/426882

The IEEE North Jersey Section's Executive Committee (EXCOM) monthly meeting will be held hybridly. The EXCOM meeting starts at 6:30 pm EST and typically ends at 8:30 pm. The meeting is meant to discuss and coordinate the activities of the Section and its Chapters and Groups, as well as new initiatives. Everyone is welcome to attend this meeting. Please register in advance for this meeting using vTools (Please make a note if you join the meeting remotely) You can change/cancel the registration if your plans change. For more information, please contact our IEEE North Jersey Section Chair Hong Zhao ([email protected]) , or Secretary, Adriaan van Wijngaarden, ([email protected]). Join Zoom Meeting https://fdu.zoom.us/j/98516896638 Meeting ID: 985 1689 6638 Note: If you are unable to join the meeting in person or online, please send your chapter activity report to the section chair at [email protected] Agenda: 06:30 pm - 06:45 pm Networking 06:45 pm - 08:30 pm IEEE North Jersey Section Executive Committee Meeting The meeting agenda typically includes news related to the IEEE and the IEEE North Jersey Section, Secretary and Treasurer reports, Chapter and Affinity Group reports, Committee reports, and reports by various Chairs and Representatives, Committee Chairs, and planning, and new initiatives. Room: M105, Bldg: Muscarellel, 1000 River Rd., Teaneck, New Jersey, United States, 07666, Virtual: https://events.vtools.ieee.org/m/430397