Ongoing

42nd Annual Microelectronic Engineering Conference at RIT

Room: 2210 - 2240, Bldg: CIMS / Slaughter Hall SLA/078 (campus map), Rochester Institute of Technology, One Lomb Memorial Drive, Rochester, New York, United States, 14623

(https://events.vtools.ieee.org/event/register/414976) This conference brings together students, faculty, alumni, friends and industry guests interested in Microelectronic Engineering. Key elements of the conference are: technical presentations by seniors on their capstone research and design projects, industry and alumni presentations, recognition of companies who have supported the program, review of program activities and achievements over the past year and industry feedback on student and academic program activities. The event begins on Monday evening with a reception and dinner at the RIT Inn & Conference Center. The reception starts at 5:30pm, with dinner at 6:30pm and speakers to follow. (https://maps.rit.edu/?details=RIT+Inn+&+Conference+Center) The technical session is on Tuesday from 8am - 4pm in the Center for Integrated Manufacturing (CIMS, SLA/078). (https://maps.rit.edu/?details=CIMS+Conference+Center) Registration is required (no charge) to determine meal orders. Speaker(s): Baljit Singh, Todd Layer, Ben Eynon, Mycahya Eggleston, Lynn Fuller Agenda: Monday April 22, 2024 5:30 p.m. Reception at the RIT Inn and Conference Center Dinner Agenda 6:30 p.m. Dinner Begins 7:00 p.m. Program Begins Welcome by Dr. Karl Hirschman, Micron Professor, Microelectronic Engineering Program Director “Semiconductor Synergy: India's Semiconductor Landscape and Collaborations with RIT”, Baljit Singh, BS MicroE ‘93, CEO of Ajuba USA/India. “Microelectronic Engineering – The Year in Review”, Dr. Robert Pearson, Past Director of the Microelectronic Engineering Program Awards - Dr. Renan Turkman Scholarship Award Announcement - Dr. Lynn Fuller Scholarship Award Announcement Closing Remarks: Dr. Karl Hirschman Tuesday April 23, 2024 8:00 – 8:30 a.m. Registration CIMS Technical Program Agenda Morning Session AM-1 Session Chair: Dr. Robert Pearson, Associate Professor 8:30 a.m. Opening Remarks, Dr. Karl Hirschman, Micron Professor, Microelectronic Engineering Program Director 8:35 a.m. “Wolfpeed Powering and Manufacturing the Possibilities“, Todd Layer, MicroE BS ‘87, Director, Equipment and Maintenance Engineering, North Carolina Fabs (NCF), Wolfspeed 9:05 a.m. “Micro Transfer Printing Tool Characterization”, Trevor Woodard, Senior MicroE ‘24 9:25 a.m. “Fabrication of a Metal-Dielectric DUV Band-pass Optical Filter”, Ian Endres, Senior MicroE ‘24 9:45 a.m. BREAK and Posters Morning Session AM-2 Session Chair: Dr. Karl Hirschman, Micron Professor 10:15 a.m. “EUV Dry Resist and Process for 2nm Node Patterning and Beyond”, Ben Eynon, MicroE BS ’87, Lam Research 10:45 am “An Exploration of SiC Top-Down Microfabrication Methods”, Laura Armellino, Senior MicroE ‘24 11:05 a.m. " Germanium Detectors for the Infrared Spectrum”, Ceili Lipp, Senior MicroE ‘24 24 11:25 a.m. “Analysis of performance of IGZO TFTs”, Alex Moore, Senior MicroE ‘24 11:45 a.m. LUNCH Afternoon Session PM-1 Session Chair: Sean Rommel, Professor 1:00 p.m. Upwards Remarks, Parsian Mohseni, Associate Professor 1:05 p.m. “Critical Dimension Uniformity - Every Angstrom Counts”, Mycahya Eggleston, BS MicroE ’17, Senior Engineer, Critical Dimension Uniformity, Micron Technology 1:35 p.m. “Cleanroom MES and SPC Systems Design and Implementation”, Carl Kulesza, Senior MicroE ‘24 1:55 p.m. “Radiation Hardening of a III-V Solar Cell Via Graded Doping”, Katelynn Blank, Senior MicroE ‘24 2:15 p.m. BREAK Afternoon Session PM-2 Session Chair: Michael Jackson, Associate Professor 2:30 p.m. “The Importance of Actually Teaching CMOS Manufacturing in a University Lab Setting”, Dr. Lynn Fuller, RIT Professor Emeritus 3:00 p.m. “Development of a Dry Etching Process for Germanium”, Dylan Bruno, Senior MicroE ‘24 3:20 p.m. “Thin Film Optical Filter for Astronomical Applications”, Tucker Dunham, Senior MicroE ’24 3:40 p.m. Technical Session Closing Remarks - Dr. Sean Rommel Room: 2210 - 2240, Bldg: CIMS / Slaughter Hall SLA/078 (campus map), Rochester Institute of Technology, One Lomb Memorial Drive, Rochester, New York, United States, 14623

Toward Self-supervised Learning of Robotic Manipulation Tasks

Room: 202, Bldg: ECE, ECE Building @NJIT, Newark, New Jersey, United States, 07102

Complex manipulation tasks combine low-level sensorimotor primitives, such as grasping, pushing, and simple arm movements, with high-level reasoning skills, such as deciding which object to grasp next and where to place it. While low-level sensorimotor primitives have been extensively studied in robotics, learning how to perform high-level task planning is relatively less explored. In this talk, I will present a unified framework for learning both low and high-level skills in an end-to-end manner from visual demonstrations of tasks performed by humans. The focus is on tasks that require manipulating several objects in sequence. The presented new techniques not only enhance current robotic capabilities but also set the stage for future advancements where robots can autonomously perform complex tasks in dynamic environments, further closing the gap between human and robotic task execution. Speaker(s): Abdeslam Boularias Room: 202, Bldg: ECE, ECE Building @NJIT, Newark, New Jersey, United States, 07102

Boston SMTA/iMAPs/IEEE Boston/New Hampshire/Providence Joint Reliability Chapter Event: “Multiscale Manufacturing-Inspection and Failure Analysis Methods for Electronics”

Bldg: Unit #4, Advanced MicroAnalytical, 50A Northwestern Drive, Salem, New Hampshire, United States, 03079

Overview: Multiscale Manufacturing-Inspection and Failure Analysis Methods for Electronics This meeting will cover laboratory techniques and test methods for a variety of samples from components to PCBA’s and whole commercial devices. A number of familiar analytical techniques will be discussed and demonstrated related to reliability and process inspection, including visual inspection and standard techniques like Ball Shear, X-ray Imaging, CSAM and other standard composite methods. Additionally, more specialized approaches to Failure Analysis, research, and process development will be demonstrated including use of multiple types of electron microscopes, spectroscopy, and Focused Ion Beam analysis for 3D examination of devices on a nano-scale. Advanced MicroAnalytical is part of the EMSL Analytical network. Coming up on 10 years this May, Advanced MicroAnalytical has been delivering in-depth scientific support for a wide range of industries and sample types. Our staff and analytical capabilities are primed to provide leading edge support for industries including, including manufacturing, micro-electronics, nano-fabrication, aerospace and defense, medical devices and more. This meeting will demonstrate the type of work flow associated with finding and understanding problems that challenge attending members – from initial product development choices, through reliability, product support, and customer facing FA efforts. Advanced MicroAnalytical is located in the hub of technology on the East Coast just north of Boston, MA, in Salem NH. Cost: Members: $25 Non-members: $30 Students/Retired: $10 IEEE and iMAPs Members please contact Mike Jansen [email protected] to receive promo code for discounted rate If you are not an SMTA member, you may click "Continue as Guest" on the registration page. Co-sponsored by: Boston SMTA and iMAPs Speaker(s): Jared Kelly, Chuck Lemieux Agenda: 5:30 PM - Registration 6:00 PM - Dinner 6:30 PM - Presentation 7:30 PM - Tour 9:00 PM - Adjourn Bldg: Unit #4, Advanced MicroAnalytical, 50A Northwestern Drive, Salem, New Hampshire, United States, 03079

MOVE Tech Talk – Apr 2024 – Exploiting Learning and Sparcity for Joint Radar Communications

Virtual: https://events.vtools.ieee.org/m/406564

Recent interest in joint radar-communications (JRC) has led to the design of novel signal processing techniques to recover information from an overlaid radar-communications signal as well as transmit a common signal for both systems. In this talk, we focus on two important tools for the design and signal processing of JRC systems: learning and sparsity. The interest in learning-based JRC is driven largely by the need to solve difficult nonconvex optimization problems inherent in a JRC design as well as to address the highly dynamic channel environments. Toward fully realizing the coexistence/co-design of both radar and communications, the optimization of resources for both sensing and wireless communications modalities is crucial. But the optimization-based approaches suffer from high computational complexity and their performance strongly relies on factors such as perfect channel conditions, specific constraints, and mobility. In this context, learning techniques provide robust performance at an upfront training cost. We discuss applying learning to various JRC aspects including channel estimation, antenna selection, resource allocation, and wideband beamforming. The second half of the talk focuses on exploiting sparsity in a general spectral coexistence scenario, wherein the channels and transmit signals of both radar and communications systems are unknown at the receiver. In this dual-blind deconvolution (DBD) problem, a common receiver admits a multi-carrier wireless communications signal that is overlaid with the radar signal reflected off multiple targets. The communications and radar channels are represented by continuous-valued range-time and Doppler velocities of multiple transmission paths and multiple targets. We exploit the sparsity of both channels to solve the highly ill-posed DBD problem by casting it into a sum of multivariate atomic norms (SoMAN) minimization. Toward the end of the talk, we focus on highlighting emerging JRC scenarios, particularly at mm-Wave and THz frequencies, vehicular applications, distributed radar-communications networks, intelligent surfaces, and aerial channels. Co-sponsored by: IEEE-USA MOVE Program Speaker(s): Kumar Vijay Mishra Virtual: https://events.vtools.ieee.org/m/406564