This roundtable aims to provide a candid exploration of empathic AI (Artificial Intelligence), and Affective Computing balancing the exciting possibilities with the critical need for privacy, human rights, and adherence to standards like the forthcoming IEEE 7014. The expansive expertise of the panelists ensures a rich and insightful discussion, offering valuable perspectives for anyone interested in the future of AI and its societal impact. We envision this roundtable as a vibrant, interactive forum, recognizing that AI, especially empathy-emulating AI, and Affective Computing is increasingly becoming an integral part of our daily existence. We warmly invite you to contribute your unique perspectives and inquiries, which are essential in shedding light on how to have this technology responsibly integrated into our everyday lives. Your active participation will enrich our dialogue. Together we will navigate the evolving landscape of empathic AI to ensure a future that resonates with our shared values and aspirations for a compassionate human centric future. Speaker(s): Hassan Al Shazly, Ph.D., Lubna Dajani, Angelo Ferraro Virtual: https://events.vtools.ieee.org/m/411143

Planned by the Region 1 and Region 2 Computer Chapters and the local NJ Coast Instrumentation & Measurements / Computer Joint Chapter, and Region 1 & 2 Professional Activities Events, and associates: Join in for a Presentation by Dr Giovanni Vannucci: Total Eclipse of the Sun: A Day at the Museum at the AT&T Labs Science & Technology Center & Museum in Middletown New Jersey. Prepare for the rare event: the 8 April Total Eclipse of the Sun that will pass through our Regions. The 26 March Event will begin at 12 Noon with a Meet and Greet Dr Giovanni Vannucci, Lunch with Leaders & Luminaries, Networking, Watch Party, STEM students, Museum Tours, and social networking. The Live Event will wind down with Cupcakes and Cookies at 3pm. Information from NASA: The Monday, April 8, 2024, total solar eclipse will cross North America, passing over Mexico, the United States, and Canada. The total solar eclipse will begin over the South Pacific Ocean. Weather permitting, the first location in continental North America that will experience totality is Mexico’s Pacific coast at around 11:07 a.m. PDT. https://science.nasa.gov/eclipses/future-eclipses/eclipse-2024/where-when/ Speaker(s): Dr Giovanni Vannucci, Agenda: 26 March 2024 12 Noon Welcome to the AT&T Labs Science and Technology Innovation Center and Museum Meet & Greet the Speaker, Dr Giovanni Vannucci, Social Experience Lunch with Leaders and Luminaries, STEM Guests Presentation by Dr Giovanni Vannucci Discussions with Colleagues and Watch Party Tour of the Museum with Expert Docents 3.00 PM Formal Program winds down with cupcakes Bldg: A, AT&T Science and Technology Innovation Center and Museum, 200 S Laurel Ave., Middletown Township, New Jersey, United States

Chiplet is a chip design method and heterogeneous integration is a chip packaging method. Chiplet design and heterogeneous integration packaging have generated lots of traction lately. For the next few years, we will see more implementations of a higher level of chiplet designs and heterogeneous integration packaging, whether it is for cost, time-to-market, performance, form factor, or power consumption. Speaker(s): John H Lau, Agenda: 6:10 PM: Networking and Refreshments 6:30 PM: Announcements and Speaker Introduction 6:35 PM: DL 7:30 PM: Questions and Answers 7:45 PM: Adjourn ============ In this lecture, the following topics will be covered. System-on-Chip (SoC) Why Chiplet Design? Chiplet Design and Heterogeneous Integration Packaging – Chip Partition and Chip Split Chip partition and Heterogeneous Integration Chip split and Heterogeneous Integration Advantages and Disadvantages Lateral Communication between Chiplets (e.g., Bridges) Bridge Embedded in Build-up Package Substrate Bridge Embedded in Fan-Out EMC with RDLs UCIe Hybrid Bonding Bridge Chiplet Design and Heterogeneous Integration Packaging - Multiple System and Heterogeneous Integration Multiple System and Heterogeneous Integration with Package Substrate (2D IC Integration) Multiple System and Heterogeneous Integration with Thin Film layer on the Package Substrate (2.1D IC Integration) Multiple System and Heterogeneous Integration with TSV-less (Organic) Interposer (2.3D IC Integration) Multiple System and Heterogeneous Integration with Passive TSV-Interposer (2.5D IC Integration) Multiple System and Heterogeneous Integration with Active TSV-Interposer (3D IC Integration) Summary Potential R&D Topics in Chiplet Design and Heterogeneous Integration Packaging Trends in Chiplet Design and Heterogeneous Integration Packaging Who Should Attend? If you (students, engineers, and managers) are involved with any aspect of the electronics industry, you should attend this course. It is equally suited for R&D professionals and scientists. The lectures are based on the publications by many distinguish authors and the books by the lecturer. Room: 201 Bluemont Room, Bldg: Arlington Central Library, 1015 North Quincy Street, Arlington, Virginia, United States, 22201, Virtual: https://events.vtools.ieee.org/m/408058

Sgt. Mitchell will discuss Human Trafficking and the impact it has on our communities and businesses. He will discuss and identify warning signs of Human Trafficking and how each and every one of us can help combat this crisis. Slavery was abolished 150 years ago yet there are more people in slavery today than at any other time in our history. Co-sponsored by: IEEE-USA MOVE Program Speaker(s): Sgt Mike Mitchell Virtual: https://events.vtools.ieee.org/m/406219