Performance requirements for today’s semiconductor and optoelectronic devices are leading to shrinking geometries, more complex 3-dimensional structures, and new materials. High temperatures, hot spots and temperature spikes can have a major impact on reliability. It is essential that one have a thorough understanding of static and dynamic thermal performance under operating and static conditions. This has traditionally been complex, time consuming, and often lacked the resolution required to detect thermal anomalies that could lead to early device failures. Fortunately, advances in thermal imaging techniques that combine the benefits of thermoreflectance-based analysis with illumination wavelengths from near-ultraviolet to near infrared coupled with infrared thermography can support thermal, spatial, and transient resolution consistent with today’s advanced complex device structures and shrinking geometries. In addition, equipment has advanced to considerably reduce the time and cost to get accurate results. Many examples will be shared to fully illustrate the device thermal behaviors that can be detected with these advanced thermal analysis techniques. Speaker(s): John H Lau, SEMI World Hdqtrs, 673 S Milpitas Blvd, Milpitas, California, United States, 950335, Virtual: https://events.vtools.ieee.org/m/336549

Edge as well as cloud computing are becoming increasingly important for a growing number of industries. The most sensible strategy is to utilize the best of both technologies, since they optimally complement one another. Smart manufacturing does not simply mean collecting vast amounts of data with the help of sensors. Far more decisive is the ability to use that data to automatically generate information that helps improve production results. By combining both Edge and Cloud computing, data processed by edge computing can be used in the cloud to train AI algorithms. Speaker(s): Sanjay Kumar is a Senior Principal, Siemens IIot, Siemens Industry, Inc, Chris Liu is the Edge Product Marking Manager, Siemens Industry, Inc. Agenda: In this session you will learn: How Siemens Industrial Edge takes care of all data integration from the shop floor to the MindSphere cloud making live data access possible on every layer up to the cloud (bi-directional) How the combination of local data processing enabled by Industrial Edge, and processing in the cloud on MindSphere can be the optimal solution to open up enormous potential for industry And examples of Edge-to-Cloud Virtual: https://events.vtools.ieee.org/m/350921

Low power consumption and scalability are the key properties of augmented reality (AR) yet to be realized to attract more users and drive new applications. Towards low-power single-user AR, we develop a novel framework, MARLIN, which only uses a DNN as needed, to detect new objects or recapture objects that significantly change in appearance. When multiple AR users collaborate in a common space, we propose FreeAR that employs collaborative time slicing to distribute compute-heavy AR tasks such as SLAM and DNNs across devices, and leverages P2P communications for message exchanges, to achieve a low energy footprint without edge infrastructure. With cellular infrastructure, AR devices can communicate with cloud servers to offload heavy computations. However, we discover that when multiple users communicate over cellular networks, AR applications experience high latencies. We characterize and understand the root causes of high latencies and perform a first-of-its-kind measurement study. Based on the study, we propose network-aware and network-agnostic AR solutions that help ramp up AR goodput by ~40-70%. Co-sponsored by: New Jersey Institute of Technology Speaker(s): Dr. Kittipat Apicharttrisorn, Room: The Lewis P. and Julia Kiernan Conference Room, Bldg: Electrical and Computer Engineering Center Suite 200, New Jersey Institute of Technology, University Heights, Newark, New Jersey, United States, 07102, Virtual: https://events.vtools.ieee.org/m/349644

This event is the Section Meeting for the NJ Coast Executive Committee Meeting. This meeting will be In Person at a New Venue in East Brunswick. Venue: SOFRA's Turkish Restaurant 415 NJ-18 #19 East Brunswick, NJ 08816 Agenda: 1. Approve / Discuss Previous Meeting Minutes 2. Review Completion of Financials and L-31's 3. Review Membership Status' 4. Volunteer / Officer Status 5. Chapter Year Plans 6. Announce 2023 Section Meeting Schedule 7. Announce 2023 Banquet Date 8. Discuss the Milestone Suggested By PACE 415 NJ-18 #19, East Brunswick, New Jersey, United States, 08816