THIS COURSE HAS BEEN CANCELLED!! Overview: One of the most demanding consumer products in the market is the wireless telecommunication product. A well-designed Radio Frequency Printed Circuit Board (RF PCB) contributes significantly to the success of any wireless product as the layout of the PCB greatly affects the performance, stability and reliability of the product. In today’s highly competitive wireless products market with increasingly compressed development time-frame, there is a strong demand for RF professionals who possess the knowledge and experience to design top-performing RF PCBs in less number of iterations. What matters is whether your level of competence is up to the required standard to meet such demand. Audience: RF Designers, Wireless Product Designers, Field Application Engineers, Design Managers and related professionals. Benefits: This course aims to provide participants with an insightful training on RF PCB design from a practical, industrial perspective. Participants will be led through a systematic, theoretical presentation with case studies on commercial products in the training. The course will be conducted by an RF expert with rich industrial experience. It is suitable for RF professionals who want to keep up-to-date their skills and knowledge in RF PCB design and stay competitive. Speaker(s): Henry Lau, Crowne Plaza Hotel, 15 Middlesex Canal Park Road, Woburn, Massachusetts, United States, 01801

Recent advances and trends in lead-free solder joint reliability are presented in this study. Emphasis is placed on the design for reliability (DFR) and reliability testing and data analysis, including: Norton power creep constitutive equations and examples; the Wises two power creep constitutive equations and examples; the Garofalo hyperbolic sine creep constitutive equations and examples; and the Anand viscoplasticity constitutive equations and examples, with temperature and strain rate-dependent parameters. For reliability testing and data analysis, the Weibull and lognormal life distributions for lead-free solder joints under thermal-cycling and drop tests; the true Weibull slope, true characteristic life, and true mean life; and the linear acceleration factors for various lead-free solder alloys based on frequency and maximum temperature, dwell time and maximum temperature; and frequency and mean temperature will be presented. Some recommendations will also be provided. Speaker(s): John H Lau, Virtual: https://events.vtools.ieee.org/m/336536