The 32nd Microelectronics Design and Test Symposium (May 8-10, 2023)
- 02/27/2023: Registration is open; please use the above link. Early registration rates deadline is April 15th.
- 02/13/2023: Submission deadline has been extended to 03/17.
- 02/05/2023: Hotel reservation is open via the link above. Please follow the instructions. (Please do not use online booking services; doing so would impact the integrity of the contract.)
- 02/07/2023: Facility is finalized – Crowne Plaza-Desmond Hotel, Albany, NY.
About MDTS 2023
The IEEE Microelectronics Design & Test Symposium (MDTS) provides a forum for academic and industry researchers and engineers to discuss the latest advances in microelectronics, share their visions in modern microelectronic technologies, and foster academic-industry collaboration. The 32nd MDTS features artificial intelligence (AI), machine learning (ML), and deep learning (DL). AI/ML/DL algorithms can be used to improve design and test by evaluating the accuracy and effectiveness of models, design rules, and test coverage. In addition, new circuits and chip architectures for AI/ML/DL applications are emerging, presenting new challenges to design and test in the form of reticle-size die, chiplets, and hardware/software co-design.
Artificial Intelligence, Machine Learning, and Deep Learning: Tactical and Strategic Impacts to Microelectronics Design and Test The IEEE Microelectronics Design & Test Symposium (MDTS) provides a forum for academic and industry researchers and engineers to discuss the latest advances in microelectronics, share their visions in modern microelectronic technologies, and foster academic-industry collaboration. The 32nd MDTS features artificial intelligence (AI), machine learning (ML), and deep learning (DL). AI/ML/DL algorithms can be used to improve design and test by evaluating the accuracy and effectiveness of models, design rules, and test coverage. In addition, new circuits and chip architectures for AI/ML/DL applications are emerging, presenting new challenges to design and test in the form of reticle-size die, chiplets, and hardware/software co-design.
Topics of interest include but are not limited to:
- Micro Devices, Circuits and Microsystems: Analog/mixed-signal/radio frequency (RF) circuits; Low-power low-voltage design; Sensors and sensing systems; Smart system design for automotive, automation and robotics; Circuits and systems for approximate and evolvable computing; Memristor- based devices; Lab-on-Chip, wearable and implantable devices; Heterogeneous integration and multi- scale chiplet-based packaging architecture
- Biomedical, Photonics, and Quantum Electronics: Biomedical and bio-inspired circuits and systems; Microelectromechanical systems (MEMS) sensors and bioelectronics; Nanobiophotonics for optical imaging, sensing, and diagnostics; Terahertz photonics for communications; Photodetectors, sensors, and imaging; Photonics for energy and green photonics
- Electronic Design & Test Methodologies and Electronic Design Automation (EDA): Electronic design tools, processes and methodologies; EDA for 3D integrations and advanced packaging; EDA for bio-inspired and neuromorphic systems; EDA tools, methodologies and applications for Photonics devices, circuit, and system design; System-on-Chip (SoC)/intellectual property (IP) testing strategies; Hardware/software co-verification; Design for testability (DFT) & built-in self-test (BIST) for digital designs, analog/mixed-signal integrated circuits (ICs), SoCs, and memories; Design verification/validation; Machine learning datasets for microelectronics design and test
- Hardware Security: Microarchitectural attacks; Side channel attacks and mitigation; (Anti-)Reverse engineering and physical attacks; Hardware obfuscation; Computer-aided design (CAD) for security; SoC security, Field-programmable gate array (FPGA) and reconfigurable fabric security; Internet-of- Things (IoTs) and cyber physical system security
- Emerging Technologies and Applications: Computing-in-memory architectures; Neural networks, AI, ML, and DL in design and test of microelectronics; IoT, edge nodes, or pipelines for real-time data visualizations and monitoring in design and test of microelectronics; Application of cognitive, neuromorphic and quantum computing; High-speed serializer/deserializer (SerDes); Next-generation design-technology co-optimization; Advanced interconnect; 3D manufacturing
The Program Committee invites researchers and practitioners to submit tutorial, panel, and special session proposals related to the theme. Proposals must include title, topic abstract, speakers’ short bio, and a list of contributing papers. The committee also encourages authors to submit original, unpublished papers on any of the topics of interest. Submissions may be six-page full papers or two- page extended summaries. Accepted papers presented at the symposium have the option of being published in IEEE Xplore®. Full details can be found on the mdts.ieee.org website.
Jake Karrfalt Best Student Paper Award
To encourage student participation in the microelectronics research community, MDTS will recognize the top student first-author paper and presentation.
Submission Due Date: 2023/03/17
Acceptance Notification Date: 2023/04/07
Final Paper Submission Date: 2023/04/30
The Program Committee invites researchers and practitioners to submit proposals for tutorial, panel, and special sessions related to the theme. Topics include:
- Methods and Procedures for Implementing AI in Design and Test of Microelectronics
- Extending Design and Test Targets and Limits Using AI
- Challenges in generating public domain or academic machine learning datasets (specific to Microelectronics) in use to demonstrate AI, ML and DL for the ETL (Extract, Transform and Load) process
- IOT, edge nodes, or pipelines for real-time data visualizations and monitoring of Microelectronic Design and Test processes and their implications on security
- Applications of Software Engineering to process and analyze Microelectronics Design and Test data
- Barriers to deploying AI/ML/DL technologies and methods to Microelectronics Design, Test, and Research practitioners
- Adopting AI, ML, and DL to manage supply chain and semiconductor test yield challenges
- Circuit design and test requirements and advancements to support AI applications implemented in hardware: new devices, compute-in-memory, high-speed serdes, etc.
- Design and test chip architecture challenges for AI applications
Papers can be submitted through the CMT tool: https://cmt3.research.microsoft.com/IEEEMDTS2023/ (Authors will first need to register for a Microsoft CMT account before submitting the paper)
For program information, contact: Uma Srinivasan, Program Chair (firstname.lastname@example.org)
For general information, contact: Kelly Ockunzzi, General Chair (email@example.com)